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  • Powerful performance: Powered by 5th Gen Intel® Xeon® Scalable processors unleash up to 21%-greater general-purpose performance per watt, significantly improving AI inference and training
  • Scale-out infrastructure: The four-node architecture design is ideal for CDN, HCI and cloud workloads to drive IT agility and digital transformation
  • Direct liquid cooling (DLC): Fully designed for cooling integration and installation, including CPU with higher TDP to increase data center efficiency and power density
  • Scale-up node design: Each node supports for dual processors, 16 DIMMs, 8 NVMe, two PCIe 5.0 x16 slots, two M.2, and two 10G LAN
  • High power efficiency: Redundant 3000W Titanium power supplies
  • Enhanced IT-infrastructure management: ASUS ASMB11-iKVM remote control with ASPEED AST2600, ASUS Control Center IT management software and hardware-level Root-of-Trust solution

PCIe 5.0 Ready
Faster storage, graphics and networking capabilities
PCI Express® (PCIe®) 5.0 delivers 32GT/s bandwidth, which is twice the speed of PCIe 4.0, and offers lower power consumption, better land scalability and backwards compatibility. ASUS servers are PCIe 5.0 ready with scalability design to satisfy the increasing workloads for modern data center.

Massive Compute Performance
Transform your data center TCO with the high-density server powered by 5th Gen Intel® Xeon® Scalable Processors. With an innovative design that fits four nodes in a 2U chassis, RS720Q-E11-RS8U accommodates dual-socket CPUs, PCIe 5.0 to satisfy the increasing demands for efficiency, density and TCO-optimization for data centers, web servers, virtualization, cloud and hyperscale environments.

Data Center Sustainability – Cooling Solutions
A comprehensive liquid cooling solution
This server is a purpose-built for intensive workloads for HPC data centers, with optimized space design to fit direct-to-chip and immersive cooling solutions, delivering lower PUE and Operating Expenditures to balance power consumption and green energy awareness. By working with our partners, we’re able to deliver a total solution — from servers to liquid-cooling modules, and even data-center floor plans and suggested infrastructure.

Direct-to-chip cooling solution
ASUS direct-to-chip cooling is a quick, simple option that’s based on existing infrastructure. D2C can be deployed quickly, and lower PUE (power-usage effectiveness). ASUS servers can support manifolds and cool plates to enable diverse cooling solutions. Moreover, ASUS servers can support a rear-door heat exchanger that complies with standard rack-server designs, so there’s no need to replace all racks — just the rear door. This lowers the total cost of ownership, and increases data-center utilization ratio.

Immersive cooling solution
ASUS Immersion cooling is another highly-effective solution from ASUS. This technique offers more advantages on PUE and encompasses higher-density servers. However, it also demands more space, and may require retooling of the data-center infrastructure. But immersion cooling can control temperatures more rapidly, efficiently and cost-effectively than traditional methods. For users of supercomputers in particular, immersion cooling is the preferred option.

5th Gen Intel® Xeon® Scalable Processors
5th Gen Intel® Xeon® processors unleashes up to 21% average general-purpose performance gain, significantly improving AI inference and training, all via the drop-in-compatible LGA-4677 socket. This innovation powerhouse accelerate AI, HPC, Analytics, Networking, Storage and offer eight DDR5-5600 memory channels for up to 2 TB capacity, 80 PCI Express® 5.0 lanes with CXL 1.1 support, and a 350 W TDP for 1P and 2P configurations — ready for the future of computing.

World Records Leadership
ASUS holds the most amount of records in dual-socket (2P) and single-socket (1P) on SPEC CPU 2017 benchmark and dominate the computing performance. These top performance results provide a useful insight into compute-intensive workloads on different computer systems, enabling our customers to reduce complexity, tackle challenging workloads and accelerate system validations.

ASUS servers feature Performance Boost technology to achieve the best server performance and agility by tuning servers to match the requirements of workloads, letting you gain greater control of your server environment. This technology improves workload throughput by maximizing processor frequency and boost power, ideal for timesensitive applications such as financial services or data center operations.

Core Optimizer
Maximizes the processor frequency in multi-core operations, avoiding frequency shifting for reduced latency.

Engine Boost
Automatic power acceleration with an innovative voltage design to increase server overall performance.

Workload Presets
Preconfigured BIOS server profiles based on workloads and benchmarks for improved performance and efficiency.

ASUS select servers achieved most power efficiency positions on the SPEC Power benchmark for energy efficiency and demonstrate to customers how they can achieve faster deployments and higher energy efficiency for their IT infrastructure.

ASUS Power Balancer
Adjust overall loading automatically based on real-time monitoring to decrease overall power consumption for Improved efficiency and cost/performance optimization.

Thermal Radar 2.0
Features intelligent fan-curve adjustments to fit the real-time server usage patterns and lower fan power consumption.

Server-management Solution

Remote server management
ASUS ASMB11-iKVM is the latest server-management solution from ASUS, built upon the ASPEED 2600 chipset running on the latest AMI MegaRAC SP-X. The module provides various interfaces to enable out-of-band server management through WebGUI, Intelligent Platform Management Interface (IPMI) and Redfish® API.

Streamline IT operations via a single dashboard
ASUS Control Center (ACC) is remote IT management software designed for monitoring your hardware and software IT assets and inventory status and enabling seamless remote BIOS configurations and updates, efficient IT diagnostics and troubleshooting and enhanced security with Hotfix updates, allowing easier server management for any IT infrastructure.

Enhanced Security

Hardware Root-of-Trust Solution
Detect, recover, boot and protect
ASUS servers integrate PFR FPGA as the platform Root-of-Trust solution for firmware resiliency to prevent from hackers from gaining access to infrastructure. ASUS security solutions are fully compliant with the 2018 National Institute of Standards and Technology (NIST) SP 800 193 specification.
* Platform Firmware Resilience (PFR) module must be specified at time of purchase and is factory-fitted. It is not for sale separately.

Trusted Platform Module 2.0
ASUS servers also include support Trusted Platform Module 2.0 (TPM 2.0) to secure hardware through integrated cryptographic keys and offer regular firmware update for vulnerabilities.

Processor
Compatible processor series Intel® Xeon®
Number of processors supported 2
Processor socket LGA 4677 (Socket E)
Motherboard chipset Intel C741
Built-in processor No
Memory
Supported RDIMM clock speeds 5600,4800 MHz
Supported DIMM module capacities 256GB, 512GB, 128GB
Supported memory types DDR5-SDRAM
Number of DIMM slots 16
Storage
SSD form factor M.2
Supported storage drive interfaces Serial ATA, Serial Attached SCSI (SAS)
Storage drive sizes supported 2.5,M.2
Number of 2.5" bays 8
Hot-swap HDD bays Yes
Number of storage drives supported 8
Graphics
On-board graphics card memory 64 MB
On-board graphics card model Aspeed AST2600
Network
LAN controller Intel® X710
Ethernet LAN data rates 10,100,1000 Mbit/s
Ethernet LAN Yes
Ethernet interface type Gigabit Ethernet
Ports & interfaces
VGA (D-Sub) ports quantity 1
Ethernet LAN (RJ-45) ports 1
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity 2
Expansion slots
Number of M.2 (M) slots 2
PCI Express x16 slots 2
PCI Express slots version 5.0
Features
Trusted Platform Module (TPM) version 2.0
Trusted Platform Module (TPM) Yes
Design
On/off switch Yes
LED indicators Yes
Product colour Black, Silver
Chassis type Rack (2U)
Power
80 PLUS certification 80 PLUS Titanium
Number of main power supplies 2
Power supply 3000 W
Operational conditions
Operating temperature (T-T) 10 - 35 °C
Storage temperature (T-T) -40 - 70 °C
Storage relative humidity (H-H) 20 - 90%
Weight & dimensions
Width 800 mm
Depth 444 mm
Height 88 mm
Weight 32.5 kg
Packaging data
Package weight 41.5 kg