Kingston Technology KSM32ES8/8HE memory module 8 GB 1 x 8 GB DDR4 3200 MT/s ECC

Kingston Technology KSM32ES8/8HE memory module 8 GB 1 x 8 GB DDR4 3200 MT/s ECC

Kingston Technology
£73.99
Stock Available: 0
  • Power Supply: VDD = 1.2V Typical
  • VDDQ = 1.2V Typical
  • VPP = 2.5V Typical
  • VDDSPD = 2.2V to 3.6V
  • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
  • Low-power auto self refresh (LPASR)
  • Data bus inversion (DBI) for data bus
  • On-die VREFDQ generation and calibration
  • Single-rank
  • On-board I2 serial presence-detect (SPD) EEPROM
  • Temperature sensor with integrated SPD
  • 16 internal banks; 4 groups of 4 banks each
  • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
  • Selectable BC4 or BL8 on-the-fly (OTF)
  • Fly-by topology
  • Terminated control command and address bus
  • PCB: Height 1.23” (31.25mm)
  • RoHS Compliant and Halogen-Free

Kingston's KSM32ES8/8HE is a 1G x 72-bit (8GB) DDR4-3200 CL22 SDRAM (Synchronous DRAM), 1Rx8, ECC, memory module, based on nine 1G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-3200 timing of 22-22-22 at 1.2V. Each 288-pin DIMM uses gold contact fingers.

Features
JEDEC standard Yes
SPD profile Yes
Programming power voltage (VPP) 2.5 V
Row active time 32 ns
Row cycle time 45.75 ns
Module configuration 1024M x 72
Memory voltage 1.2 V
Memory ranking 1
Memory data transfer rate 3200 MT/s
CAS latency 22
ECC Yes
Memory form factor 288-pin DIMM
Component for Server
Internal memory type DDR4
Memory layout (modules x size) 1 x 8 GB
Internal memory 8 GB
Buffered memory type Unregistered (unbuffered)
Operational conditions
Storage temperature (T-T) -55 - 100 °C
Operating temperature (T-T) 0 - 85 °C
Technical details
Compliance certificates RoHS
Weight & dimensions
Height 31.2 mm
Width 133.3 mm