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  • Intel® Xeon® E7 V2 Family E7-8891V2 3.2 GHz
  • 37.5 MB L3 LGA 2011 (Socket R)
  • Processor cores: 10 22 nm 64-bit 155 W
  • Maximum internal memory supported by processor: 1.54 TB DDR3-SDRAM

We are in a multi-year journey to turn HP around, and we have put in place a plan to restore HP to growth. We know where we need to go, and we're making progress.

We continue to drive product innovation in our core markets, with a focus on cloud, security, and big data.

We see big opportunities ahead, and we are well positioned to take advantage of these opportunities with our remarkable set of assets and strengths. We have the people, the plan, and the foundation in place to help us succeed on the next phase of the journey.

Processor
Memory bandwidth supported by processor (max) 85 GB/s
Number of QPI links 3
Bus type QPI
Thermal Design Power (TDP) 155 W
Processor cache type L3
Processor cache 37.5 MB
Processor boost frequency 3.7 GHz
Processor operating modes 64-bit
System bus rate 8 GT/s
Processor threads 20
Component for Server/workstation
Processor lithography 22 nm
Processor socket LGA 2011 (Socket R)
Processor cores 10
Processor base frequency 3.2 GHz
Processor model E7-8891V2
Processor family Intel® Xeon® E7 V2 Family
Memory
ECC Yes
Memory channels Quad-channel
Memory clock speeds supported by processor 1066,1333,1600 MHz
Memory types supported by processor DDR3-SDRAM
Maximum internal memory supported by processor 1.54 TB
Graphics
On-board graphics card No
Features
Scalability S8S
Embedded options available No
PCI Express slots version 3.0
Maximum number of PCI Express lanes 32
Market segment Server
Execute Disable Bit Yes
Idle States Yes
Thermal Monitoring Technologies Yes
Processor special features
Intel VT-x with Extended Page Tables (EPT) Yes
Intel Virtualization Technology for Directed I/O (VT-d) Yes
Intel® Secure Key Yes
Intel TSX-NI No
Intel® Hyper Threading Technology (Intel® HT Technology) Yes
Intel® Turbo Boost Technology 2.0
Intel® AES New Instructions (Intel® AES-NI) Yes
Intel Trusted Execution Technology Yes
Enhanced Intel SpeedStep Technology Yes
Operational conditions
Tcase 77 °C
Packaging data
Package depth 45 mm
Package width 52 mm
Other features
Intel® Virtualization Technology (Intel® VT) VT-d