£118.99

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  • Toshiba 64-Layer BiCS FLASH™
  • PCIe® Gen3 2L NVMe™
  • Capacities up to 512GB
  • M.2 1620 single package and M.2 2230 single-sided form factor
  • TCG OPAL 2.01 Optional for SED

The BG3 series leverages 64-layer, 3-bit-per-cell (TLC) BiCS FLASH™ and features NVMe™ Revision 1.2.1. With Host Memory Buffer (HMB) technology, this SSD series retains high performance in a DRAM-less architecture, while enabling reduced power and a smaller footprint.

BG3 SSDs, as an innovative, next generation single-package ball grid array (BGA) SSD product line, harness the flexibility in system design that enables mobile computing and IoT embedded devices to be smaller, lighter, faster, and more power efficient. Also, these power-saving BG3 SSDs offer data center applications an alternative solution for server boot storage.

The BG3 series is available in 128GB, 256GB, and 512GB capacities. All three models are available in a surface-mount single package M.2 1620 or a removable module M.2 2230 form factor. BG3 SED models are also available.

Features
Write speed 1000 MB/s
Read speed 1500 MB/s
Hardware encryption No
Component for Laptop
Memory type TLC
NVMe Yes
Interface PCI Express 3.1
SSD form factor M.2
SSD capacity 512 GB
Power
Power consumption (write) 3.3 W
Power consumption (read) 3.3 W
Operating voltage 3.3 V
Weight & dimensions
Weight 2.42 g
Height 2.38 mm
Depth 30 mm
Width 22 mm
Operational conditions
Non-operating shock 1.5 G
Operating shock 14.7 G
Non-operating vibration 20 G
Operating vibration 196 G
Storage temperature (T-T) -40 - 85 °C
Operating temperature (T-T) 0 - 80 °C
Logistics data
Harmonized System (HS) code 84717070